Having recently buying an analog to digital converter and a prototype adaptor board for an SOIC, I decided to use my reflow tool I bought a few month back. One thing I didn’t take into account was that my solder paste was out of date in November 2011, making it fairly thick and hard to separate.
Also it turns out the display on my reflow tool is in Fahrenheit, not Celsius.
The second one however, a digital to analog converter, turned out far worse of a job. It is a TSSOP package – a fraction the size of the SOIC, and I have trouble with bridges being formed between pins, and my cheap solder wick was failing to remove them.
I’m unsure if the chips still work, as I took quite a while to get them in the correct position, but I was 40-60 degrees lower than the maximum soldering temperature. Hopefully I will have time to test them tomorrow.